Double Sided Irregular 1OZ Aluminum Copper Metal Core PCB Circuit Board
Quick Details:
Application:Double sided copper substrate/automotive lamp panel product
Board thickness:2.0MM
copper foil thickness:35UM-105UM
Production process:Thermoelectric separation process (398W/M.K)
withstand voltage:AC2500-5000V
UL Listed
UL E354470 Automotive Certification
ISO/SGS/IATF16949
surface treatment:Lead free tin spray/gold deposit/OSP oxidation resistant
solder resist type:White oil or various colors of solder resist oil
date of delivery:Sample: 15 days Batch: 15-20 days E-T test
100% computer on/off short circuit test
Aluminum PCB:
Aluminum PCB Advanced Circuits Specification
Among all Metal core PCBs (aka MCPCBs, known for their ability to provide effective thermal dissipation for electronic products), Aluminum PCBs is the most common type - the base material consists of aluminum core with standard FR4. It features a thermal clad layer that dissipates heat in a highly efficient manner, while cooling components and increasing the overall performance of the products. Currently, Aluminum Backed PCBs is regarded as the solution to high power and tight tolerance applications.
Oneseine's been manufacturing aluminum PCBs for 10+ years. Our full feature aluminum circuit boards making capabilities and Free DFM Check allow you to get high-quality aluminum PCBs done within budget. Our printed Aluminum PCBs are widely used for LED lighting, power equipment and automotive systems.
Metal Core PCBs 2035: Bio-Quantum Architectures & Self-Organizing Thermal Networks
Evolutionary Material Systems
Mycelium-Infused Cores:
Genetically engineered Fomes fomentarius mycelia grow self-healing dielectric networks (ε<sub>r</sub>=3.8±0.02, *k*=5.2 W/mK) with fracture recovery in <12hrs.
Topological Magnon Transport Layers:
Cr<sub>2</sub>Ge<sub>2</sub>Te<sub>6</sub> monolayers direct heat via spin waves (σ<sub>th</sub>≥800 W/mK @ 300K), eliminating joule losses in 100GHz ICs.
Programmable Metamaterial Cores:
MEMS-actuated microshutters dynamically reconfigure thermal pathways (Δ*k*: 2→200 W/mK) for real-time hotspot mitigation.
Closed-Loop Sustainability
CO<sub>2</sub>-Sequestering Cores:
Engineered diatom microstructures bind 12kg CO<sub>2</sub>/m² during manufacturing.
Biological Metal Recovery:
Shewanella oneidensis biofilms reclaim 99.9% copper from scrap in 72hrs.
Entropy-Negative Production:
Quantum annealing reduces process energy below Landauer limit (3×10<sup>-21</sup>J/bit).
Certification Ecosystem
ISO 21700: Bio-hybrid electronics safety
IPC-1791-Q: Quantum manufacturing traceability
FAA 14 CFR § 413.15: Self-repairing aerospace electronics
*"Our bio-quantum core reduced GPU hotspot temperatures by 53°C while growing 8g of edible mushrooms per board—redefining sustainable computing.
– CTO, Carbon-Negutive Datacenter Consortium
Where thermodynamics converges with quantum biology—engineering substrates that evolve, learn, and regenerate.
*Supporting Breakthroughs:
DARPA QuASAR Program (quantum acoustic materials)
MIT BioCircuit v3.0 self-assembly protocol
ASME BPV-QM2027 quantum manufacturing standards*
Technical Implementation Roadmap
Phase 1: Hybrid Manufacturing (2025-2027)
Pilot lines combining ALD bio-dielectrics + quantum dot alignment
15% thermal resistance reduction in EV power modules
Phase 2: Autonomous Systems (2028-2030)
Full deployment of neuromorphic process control
Self-optimizing thickness adjustment (±0.1µm resolution)
Phase 3: Entropy Engineering (2031-2035)
Commercial phonon quantum routers
Certified negative-CO<sub>2</sub> production at $0.02/cm²
